wafer fab Technician

Duration: 12 Months
Schedule: Shift 1

Responsibilities:

• Perform technical tests and experiments for process engineering, including the set up and operation of process equipment
• Prepare records, charts, and graphs of test results
• Operate metrology tools, (including particle counter, film thickness measurement, and others as needed), to qualify process equipment and optimize processes
• Adjust hardware/software parameters to correct issues or execute experiments
• Work closely with cross-functional engineering teams to troubleshoot process/integration problems
• Perform minor electrical or mechanical troubleshooting on equipment
• Perform preventative and unscheduled maintenance on process equipment

Qualifications:

• Minimum of 3-4 years of semiconductor processing experience in thin film deposition, or etch, preferably in a high-volume manufacturing facility
• Experience with troubleshooting and maintaining vacuum-based processing equipment
• Skilled in the use of Microsoft Office applications (Outlook, Word, Excel, and PowerPoint)
• Excellent communication and problem-solving skills
• Self-starting individual with strong technical and hands-on skills
• Associates degree or equivalent

Physical Requirements:

• Job duties are often performed in confined areas in a clean room environment, in awkward positions and/or in high places.
• Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds is required.
• May require bending/stooping/crawling/climbing.
• May require the use of Personal Protection equipment and proper industry safety procedures when working with one or more dangerous element or conditions such as chemicals, electric currents or high voltage, moving mechanical parts, radiation, etc.
• Occasional overnight travel to factory, training facilities and customer locations may be required.