Manufacturing Integration Engineer

onsemi is seeking a Manufacturing Integration Engineer in our EFK Hopewell Junction site. We are a leading innovator in semiconductor technology, dedicated to advancing power electronics through cuttingedge research and development. We are seeking a talented and motivatedSenior principal engineer to join our team and drive Technology transfers and Manufacturability of nextgenerationdiscrete power FET technologies. This role offers high technical ownership, crossfunctional visibility, and the opportunity to directly shape onsemis future power device roadmap.

Responsibilities

• Lead technology transfer and manufacturabilityfor onsemis advanced nodes of discrete power FETs, owning device architecture from concept definition through qualification and highvolume manufacturing.

• Monitor electrical performance and device performance, collaborating with design, process integration, and modeling teams to optimize Rds(on), switching performance, ruggedness, and power density.

• Partner withprocess module ownersin the fab to optimize process windows, ensure device robustness, and resolve integration challenges.

• Performdevice characterization, electrical testing, and failure analysis, ensuring compliance with specifications and customer requirements.

• Drivestructured rootcause analysis(DOE, 6sigma, SPC, FMEA) for yield, reliability, or devicerelated issues, and implement sustainable corrective actions.

• Collaborate withsystems engineering, product engineering, packaging, and applications teamsto integrate power FETs into systemlevel solutions and endcustomer applications.

• Monitor industry trends and emerging device concepts in power MOSFET, superjunction, and widebandgap (SiC/GaN) technologies.

• Generateinvention disclosures, patents, and technical reportsto strengthen onsemis IP portfolio and documentation standards.

• Providetechnical guidance, coaching, and mentorshipto junior engineers; matrixmanage engineers across multiple organizations.

• Present technical content inexecutivelevel reviewsand represent the team in crossfunctional and customerfacing discussions.

Qualifications

• Masters or Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field.

• Proven experience insemiconductor manufacturing, specifically with discrete power FETs (trench MOSFETs, superjunction, or related structures).

• Experience with post wafer fab operations such as Back-Grind/Back Metallization, Packaging, Dicing and Singulation, module construction.

• Experience with wafer level testing, ILT/WAT/PCM and Probe. Familiarity with package level Final Testing especially for discrete power devices

• Experience taking technologies from development stage, through optimization and qualification and into volume ramp.

• Strong understanding ofsemiconductor physics, device reliability, and fabrication processes, including experience in300mm fabrication.

• Demonstrated ability totranslate highlevel objectivesinto actionable engineering plans and drive projects independently.

• Strong datadriven problemsolving skills using DOE, statistical analysis, SPC, 6sigma, and FMEA methodologies.

• Track record of leading or significantly contributing to technology development projects with measurable impact onperformance, reliability, yield, or cost.

• Excellent communication skills with the ability to present complex technical topics clearly to both engineering and executive audiences.

• Ability to manage multiple projects simultaneously in a fastpaced development environment

Salary: onsemi is excited to share the base salary range for this position is $127,800 to $217,200, exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package.