Sr Manager Design Engineering, HBM

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Design Development Technical Lead (DDTL) is accountable for predictable, timely delivery of HBM build achievements across the composing phase of the product lifecycle. This role serves as the singlethreaded technical program owner for HBM design execution, coordinating across DRAM, base die, test vehicles, interposers, IP, and internal and external foundries.

Operating within Microns Heterogeneous Integration Group (HIG), the DDTL leads multifunctional execution, manages build dependencies and risks, owns change control, and represents HBM Build in PDT and executive forums to ensure schedule, cost, quality, and product objectives are met.

• Own endtoend execution of onschedule delivery of HBM develop achievements, ensuring alignment across DRAM, base die, test chips, PTVs, interposers, and sustaining develops.

• Lead execution governance, including DDTL Syncs and Design Program Reviews (DPRs), providing clear executivelevel status, risks, and decision asks.

• Own and operate formal Change Control Board (CCB) processes, ensuring disciplined POR management, cost and schedule awareness, and full traceability.

• Maintain a comprehensive design risk register; proactively identify risks, lead mitigation workgroups, define checkpoints, and advance issues through governance forums as required.

• Capture and institutionalize lessons learned to improve future program execution.

• Drive early engagement during architecture and design phases to enable shiftleft risk mitigation.

• Lead initiatives to optimize die size, DFM, yield, cost, power, and manufacturing efficiency.

• Lead designphase engagement with foundries and IP providers, identifying and resolving execution dependencies.

• Own IP forecasting, selection, and prioritization, aligning technical needs with budget and roadmap constraints.

• Lead design contractor, IP vendor, and procurement engagements supporting design execution.

• Own designphase financial accountability for the HBM portfolio.

• Develop IP cost projections, track actuals, manage approvals, and drive prioritization aligned to design and business objectives.

• Manage mask cost planning and execution for test vehicles, test chips, and live die across TSMC and UMC nodes, ensuring cost transparency and schedule alignment.

• Serve as the programlevel central owner of the HBM design roadmap.

• Maintain, integrate, and communicate roadmap updates across Design, PDT, and executive partners.

• Capture customer requirements and schedules for customized HBM products and ensure execution alignment.

• Partner with Business, Finance, and Product teams to align design execution with roadmap and market priorities.

• Provide concise, datadriven executive communications and advance critical issues when necessary.

• Define, standardize, and deploy program management tools and dashboards (e.g., Jira, status templates, CCB workflows).

• Monitor and report key execution metrics to drive corrective actions and continuous improvement.

• Develop scalable business processes to support increasing portfolio complexity and expanding design scope.

• Understanding of custom and digital design flows and the full SoC/DRAM development lifecycle.

• Demonstrated ability to lead large, multifunctional technical programs through influence and execution rigor.

• Experience working with foundries, IP vendors, and ecosystem partners.

• Knowledge of DRAM operation, preferably within the HBM product family.

• Familiarity with industry standards and compliance requirements (e.g., JEDEC).

• 12+ years of relevant industry experience.

• Bachelors degree or equivalent experience in Electrical Engineering or a related field.

• Strong analytical, problemsolving, and decisionmaking skills.

• Experience with formal program or project management methodologies.

• Strong executive communication skills and ability to operate effectively in a fastpaced, dynamic environment.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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